Effect of different sputtering time on the formation of copper and copper oxide nano particles by magnetron sputtering system

Abstract

Synthesis of copper (Cu) and copper oxide nano particles on SiO₂ (silicon oxide) substrate by dc (direct current) magnetron sputtering technique are investigated. A copper cylindrical target was used in Ar plasma medium for deposition under 2 · 10⁻² m Torr pressure. The changing of structural form of Cu particles in function of sputtering time has been studied. Powder diffraction patterns provided information about the crystal structure of the surface and the lattice parameter values of the particles. The Atomic Force Microscope (AFM) images revealed a homogeneous structure and size of particles and revealed a homogeneous dispersion within the layer. SEM/EDX was applied to characterize the nanostructures of Cu nanoparticles.