Surface Protection of Low-Melting Glass Based Silicon Substrates for Silicon Transistor Fabrication


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Abstract

Different methods are proposed for protecting the surfaces of silicon substrates in the fabrication of silicon transistors. The results of thermal operations with technological regimes for obtaining a low-melting glassy layer in order to protect the surface of p – n junction substrates from different external actions are presented.

About the authors

T. A. Ismailov

Dagestan State Technical University

Author for correspondence.
Email: bijke@mail.ru
Russian Federation, Makhachkala, Dagestan

T. É. Sarkarov

Dagestan State Technical University

Email: bijke@mail.ru
Russian Federation, Makhachkala, Dagestan

B. A. Shangereeva

Dagestan State Technical University

Email: bijke@mail.ru
Russian Federation, Makhachkala, Dagestan

A. R. Shakhmaeva

Dagestan State Technical University

Email: bijke@mail.ru
Russian Federation, Makhachkala, Dagestan

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