Email this article Calculation of Thermal Processes in a Bonded Diamond Tool During Grinding of Glass and Other Materials
- Authors: Kondratenko V.S.1, Kadomkin V.V.1
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Affiliations:
- MIREA – Russian Technological University
- Issue: Vol 75, No 11-12 (2019)
- Pages: 428-434
- Section: Materials Processing
- URL: https://journal-vniispk.ru/0361-7610/article/view/245095
- DOI: https://doi.org/10.1007/s10717-019-00105-6
- ID: 245095
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Abstract
The results of calculations of thermal processes occurring in a bonded diamond tool during grinding of different materials on the surface in the contact zone with the machined material and in the interior of the diamond tool are presented. Amathematical model of the heating of the binder of the diamond tool as a result of friction in the grinding zone and cooling by a cutting liquid (CL) is described.
About the authors
V. S. Kondratenko
MIREA – Russian Technological University
Author for correspondence.
Email: vsk1950@mail.ru
Russian Federation, Moscow
V. V. Kadomkin
MIREA – Russian Technological University
Email: vsk1950@mail.ru
Russian Federation, Moscow
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