Kinetic model of copper electrodeposition in sulfate solution containing trisodium citrate complexing agent

Abstract

Simultaneous solution of two kinetic models of electrodeposition of copper in sulfate solution is studied in this paper. Bulk concentration of species involved in the numerical solution was calculated using MATLAB software. COMSOL Multiphysics software was used for the numerical solution of copper electrodeposition. Numerical results were evaluated using experimental data obtained by linear sweep voltammetry technique. The experimental data was almost fitted using COMSOL optimization physic module. It was found that kinetic parameters of Cu²⁺ (k^1Cu), Cu¹⁺ (k_2Cu), and CuCitH (k_1CuCitH) and diffusion coefficient and charge transfer coefficient of Cu²⁺ (\({D_{C{u^{2 + }}}}\), α_Cu1), Cu¹⁺ (α_Cu2) and CuCitH (D_CuCitH, α_CuCitH) affect the fitting of the experimental data with the computed ones. The variables such as concentration profiles and optimum kinetic parameters that cannot be experimentally measured were achieved by analysis of the model. The parameters, that not affect the fitting, were recognized and kept constant when using the optimization.