Development of Field Alignment Methods for Electron-Вeam Lithography in the Case of X-Ray Bragg–Fresnel Lenses
- Authors: Knyazev M.A.1, Svintsov A.A.1, Fahrtdinov R.R.1
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Affiliations:
- Institute of Microelectronics Technology and High Purity Materials
- Issue: Vol 12, No 5 (2018)
- Pages: 957-960
- Section: Article
- URL: https://journal-vniispk.ru/1027-4510/article/view/196010
- DOI: https://doi.org/10.1134/S1027451018050270
- ID: 196010
Cite item
Abstract
A method providing more than a tenfold improvement in the precision of exposure field alignment in electron-beam lithography is proposed. The method uses a scanning electron microscope with a standard mechanical positioning system and alignment markers produced by contact photolithography. Bragg–Fresnel lens (1–3–5 orders) with a tenfold decrease in the error of exposure field alignment through the use of mechanical stages are created via this technique.
About the authors
M. A. Knyazev
Institute of Microelectronics Technology and High Purity Materials
Author for correspondence.
Email: maleksak@iptm.ru
Russian Federation, Chernogolovka, Moscow oblast, 142432
A. A. Svintsov
Institute of Microelectronics Technology and High Purity Materials
Email: maleksak@iptm.ru
Russian Federation, Chernogolovka, Moscow oblast, 142432
R. R. Fahrtdinov
Institute of Microelectronics Technology and High Purity Materials
Email: maleksak@iptm.ru
Russian Federation, Chernogolovka, Moscow oblast, 142432
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