Effect of collisions on the angular distribution of ions under plasmachemical etching
- 作者: Devyatko Y.N.1,2, Fadeev A.V.2
- 
							隶属关系: 
							- National Research Nuclear University “MEPhI,”
- Institute of Physics and Technology
 
- 期: 卷 43, 编号 8 (2017)
- 页面: 838-843
- 栏目: Plasma Technologies
- URL: https://journal-vniispk.ru/1063-780X/article/view/186188
- DOI: https://doi.org/10.1134/S1063780X17080050
- ID: 186188
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详细
The most important parameter responsible for the quality of high-aspect structures produced by plasmachemical etching is the angular distribution of ions near the processed surface. In this work, the effect of collisions and gas pressure on the angular distributions of ions and chemically active radicals in the chamber of a high-pressure plasmachemical reactor with a remote plasma source is analyzed theoretically.
作者简介
Yu. Devyatko
National Research Nuclear University “MEPhI,”; Institute of Physics and Technology
							编辑信件的主要联系方式.
							Email: ydevyatko@mail.ru
				                					                																			                												                	俄罗斯联邦, 							Moscow, 115409; Moscow, 117218						
A. Fadeev
Institute of Physics and Technology
														Email: ydevyatko@mail.ru
				                					                																			                												                	俄罗斯联邦, 							Moscow, 117218						
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