Model for Thermal Oxidation of Silicon
- 作者: Fadeev A.V.1, Devyatko Y.N.2
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隶属关系:
- Valiev Institute of Physics and Technology, Russian Academy of Sciences
- National Research Nuclear University MEPhI (Moscow Engineering Physics Institute)
- 期: 卷 64, 编号 4 (2019)
- 页面: 575-581
- 栏目: Physical Electronics
- URL: https://journal-vniispk.ru/1063-7842/article/view/203335
- DOI: https://doi.org/10.1134/S1063784219040108
- ID: 203335
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详细
Nanometer-thick silicon oxide films are needed for miniaturization and increase in the working rate of electronic devices. Interpretation of the initial stages of silicon oxidation is necessary for fabrication of such structures. A theoretical model of the thermal oxidation of thin silicon monolayers that takes into account an increase in the stress in the transition (oxide–substrate) layer due to oxygen accumulation therein is proposed.
作者简介
A. Fadeev
Valiev Institute of Physics and Technology, Russian Academy of Sciences
编辑信件的主要联系方式.
Email: AlexVFadeev@gmail.com
俄罗斯联邦, Moscow, 117218
Yu. Devyatko
National Research Nuclear University MEPhI (Moscow Engineering Physics Institute)
编辑信件的主要联系方式.
Email: ydevyatko@mail.ru
俄罗斯联邦, Moscow, 115409
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