Model for Thermal Oxidation of Silicon


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Nanometer-thick silicon oxide films are needed for miniaturization and increase in the working rate of electronic devices. Interpretation of the initial stages of silicon oxidation is necessary for fabrication of such structures. A theoretical model of the thermal oxidation of thin silicon monolayers that takes into account an increase in the stress in the transition (oxide–substrate) layer due to oxygen accumulation therein is proposed.

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A. Fadeev

Valiev Institute of Physics and Technology, Russian Academy of Sciences

编辑信件的主要联系方式.
Email: AlexVFadeev@gmail.com
俄罗斯联邦, Moscow, 117218

Yu. Devyatko

National Research Nuclear University MEPhI (Moscow Engineering Physics Institute)

编辑信件的主要联系方式.
Email: ydevyatko@mail.ru
俄罗斯联邦, Moscow, 115409

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