Metallographic Analysis during Multilayer Printed Circuit Board Production Quality Assurance with Interlayer Connections Composed of Radio-Electronic Systems

Abstract

The current state of the high-tech radio-electronic industry, including special and dual-purpose products, is considered. The main causes of space electronics failures are revealed. The estimation of modern manufacturing technical requirements for printed circuit boards is given as one of the main reasons for failure. The combined method of defect study and production quality assurance of multilayer printed circuit boards with interlayer connections composed of complex radio-electronic systems is proposed.