On the rheological behavior of nanoparticles in the force field of the solid surface: Nanotechnological aspects

Abstract

The spreading of solid Cu nanoparticles (1–10 nm in diameter) on the (100) Cu surface and solid Au nanoparticles on the (100) Au face is simulated via molecular dynamics. The results for the Cu (nanoparticle)/( 100) Cu system are compared with the available experimental data for Cu microparticles (0.1–10 μm) spreading on the polycrystalline Cu surface. The solid-state spreading phenomenon is found to play an important role in many natural and technological processes. Some potential applications in nanotechnology and restrictions in the operation characteristics of nanosized units and nanomaterials are discussed as well.