Local structure of titanium nitride-based coatings


Cite item

Full Text

Open Access Open Access
Restricted Access Access granted
Restricted Access Subscription Access

Abstract

The fine structure of X-ray absorption spectra near the K edge and the extended fine structure of X-ray absorption for titanium, copper, and chromium in nanocrystalline coatings based on titanium nitride doped with copper, chromium, and silicon are experimentally studied. The samples are prepared by the evaporation of composite cathodes using the vacuum arc plasma-assisted method. The parameters of the local environment of titanium, copper, and chromium atoms in the structures of the samples under study are calculated. It is established that the presence of a copper impurity in the coating of no more than 12% in amount leads to a slight increase in the Ti–N distance in comparison with the titanium sample, whereas doping with silicon leads, on the contrary, to a decrease in the bond length. The measurement results for the K absorption edges of copper and chromium confirm that the doping elements are concentrated at the edges of the growing titanium-nitride crystallite and determine its size, which corresponds to the sizes of the coherent-scattering region of 40–50 nm.

About the authors

N. A. Timchenko

Tomsk Polytechnic University

Email: smit@tpu.ru
Russian Federation, Tomsk, 634050

Ya. V. Zubavichus

National Research Centre “Kurchatov Institute,”

Email: smit@tpu.ru
Russian Federation, Moscow, 123098

O. V. Krysina

Institute of High-Current Electronics, Siberian Branch

Email: smit@tpu.ru
Russian Federation, Tomsk, 634055

S. I. Kuznetsov

Tomsk Polytechnic University

Author for correspondence.
Email: smit@tpu.ru
Russian Federation, Tomsk, 634050

M. S. Syrtanov

Tomsk Polytechnic University

Email: smit@tpu.ru
Russian Federation, Tomsk, 634050

S. V. Bondarenko

Tomsk Polytechnic University

Email: smit@tpu.ru
Russian Federation, Tomsk, 634050

Supplementary files

Supplementary Files
Action
1. JATS XML

Copyright (c) 2016 Pleiades Publishing, Ltd.