Active thermal testing of hyperthermoconductive panels

Abstract

Application of active infrared thermography to assessing the internal structure and functioning of hyperthermoconductive panels used in on-board electronics is described. Effective thermal- diffusivity maps of hyperthermoconductive panels, obtained using the pulsed Parker method, are presented. The peculiarities of heat transfer in hyperthermoconductive panels are illustrated using experimental modeling in which a local thermal-load source is placed on the surface of hyperthermoconductive panels.