Influence of Extrusion Temperature on the Formation of a Bi0.5Sb1.5Te3 Structure of p-Type Conductivity

Abstract

The influence of competing processes of deformation, return, and recrystallization on the structure and properties of thermoelectric materials extruded at different temperatures is investigated. X-ray diffraction analysis, Harman’s method of measuring thermoelectric properties, and hydrostatic weighing are applied. The nonmonotonic dependence of the texture, electrophysical properties, and density on the extrusion temperature is revealed. In order to achieve the best thermoelectric properties of the material, the optimal extrusion temperature is established to be 400°C.