Laser Micromilling Technology as a Key for Rapid Ceramic MEMS Devices


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Abstract

The flexible laser micromilling technology for ceramic MEMS production of microhotplates in the surface mount device (SMD) package is described. Current results demonstrate that using described technology makes it possible to manufacture all parts of MEMS sensor in the SMD with form factor of SOT-23 package type.

About the authors

K. Yu. Oblov

National Research Nuclear University MEPhI (Moscow Engineering Physics Institute)

Email: NNSamotaev@mephi.ru
Russian Federation, Moscow, 115409

N. N. Samotaev

National Research Nuclear University MEPhI (Moscow Engineering Physics Institute)

Author for correspondence.
Email: NNSamotaev@mephi.ru
Russian Federation, Moscow, 115409

M. O. Etrekova

National Research Nuclear University MEPhI (Moscow Engineering Physics Institute)

Email: NNSamotaev@mephi.ru
Russian Federation, Moscow, 115409

A. V. Gorshkova

National Research Nuclear University MEPhI (Moscow Engineering Physics Institute)

Email: NNSamotaev@mephi.ru
Russian Federation, Moscow, 115409

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