Target cleaning for faster CrN/AlN coating growth in magnetron sputtering


Cite item

Full Text

Open Access Open Access
Restricted Access Access granted
Restricted Access Subscription Access

Abstract

Metallic sputtering may be used to clean the target surface in the course of coating application by reactive magnetron sputtering. The introduction of additional stages of metallic sputtering in reactive magnetron sputtering increases the growth rate of CrN/AlN coatings by around 23%, with little change in physicomechanical properties.

About the authors

I. M. Bukarev

Stoletov Vladimir State University

Email: aborkin@vlsu.ru
Russian Federation, Vladimir

A. V. Sobol’kov

Stoletov Vladimir State University

Email: aborkin@vlsu.ru
Russian Federation, Vladimir

A. V. Aborkin

Stoletov Vladimir State University

Author for correspondence.
Email: aborkin@vlsu.ru
Russian Federation, Vladimir

Supplementary files

Supplementary Files
Action
1. JATS XML

Copyright (c) 2017 Allerton Press, Inc.