Influence of Annealing Temperature on Electrically Active Centers in Silicon Implanted with Germanium Ions


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Resumo

The implantation of Czochralski-grown p-type silicon with 1-MeV germanium ions at a dose of 2.5 × 1014 cm–2 does not lead to the amorphization of single-crystal silicon. Under subsequent high-temperature annealing, electrically active acceptor centers are transformed. Their concentration and special distribution depend on the annealing temperature. The possible factors determining how these centers are formed are discussed.

Sobre autores

N. Sobolev

Ioffe Institute

Autor responsável pela correspondência
Email: nick@sobolev.ioffe.rssi.ru
Rússia, St. Petersburg, 194021

O. Aleksandrov

St. Petersburg State Electrotechnical University LETI

Email: nick@sobolev.ioffe.rssi.ru
Rússia, St. Petersburg, 197376

V. Sakharov

Ioffe Institute

Email: nick@sobolev.ioffe.rssi.ru
Rússia, St. Petersburg, 194021

I. Serenkov

Ioffe Institute

Email: nick@sobolev.ioffe.rssi.ru
Rússia, St. Petersburg, 194021

E. Shek

Ioffe Institute

Email: nick@sobolev.ioffe.rssi.ru
Rússia, St. Petersburg, 194021

A. Kalyadin

Ioffe Institute

Email: nick@sobolev.ioffe.rssi.ru
Rússia, St. Petersburg, 194021

E. Parshin

Yaroslavl Branch, Institute of Physics and Technology, Russian Academy of Sciences

Email: nick@sobolev.ioffe.rssi.ru
Rússia, Yaroslavl, 150007

N. Melesov

Yaroslavl Branch, Institute of Physics and Technology, Russian Academy of Sciences

Email: nick@sobolev.ioffe.rssi.ru
Rússia, Yaroslavl, 150007

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